PWB Corporation

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PCB Design/Fab/Assy >> Fabrication

Fabrication

Advantage for PCB Fabrication
ATE Performance Board
Low Permittivity Build-up Board

Advantage for PCB Fabrication

One piece quick turn prototype and small to large lot production
Double sided and 4 to 68+ layer PCBs
Laser plotter and etching line for 30m line width
Special plating line for aspect ratio of 20 to 1.
Processing technology of 50}5% impedance controlled PCB

ATE Performance Board

Integration of all technologies of manufacturing and know-how for fine pitch. high layer count, high aspect ratio plating. controlled impedance, and the low permittivity material is the key to manufacturing the semiconductor tester boards.

Quick-turn fabrication of high layer count PCB

(20-68 Layers, SVH, Build-up PCB)

High aspect ratio PCB fabrication by in-house special plating line

(ex. 0.25mm FHS for 5.4mm thickness board, Aspect ratio = 21:1)

1.1-1.5um electroless gold surface finish

(Pogo area may be finished with thick bonding gold)

Fabrication of fine pitch CSP device PCB
High aspect ratio PCBHigh aspect ratio PCB
Thickness = 4.8t
Drill hole = Φ0.25
LTX-CREDENCE ITS9000ZXLTE-CREDENCE Company ITS9000ZX
V93000 V93000
TERADYNE UltraFlex,J750,CATALYST
TERADYNE Company UltraFlex,J750,CATALYST
Other
ADVANTEST T2000,T65../T66..
Yokogawa Electric TS6000H
Shibasoku WL25
PROBE-CARD
DUT-CARD
Socket Board

Low Permittivity Build-up Board

2GHz/5GHz 0.4mm pitch CSP Device PCB
Material Characteristics
Frequency 1`10
Dielectric constant 2.8
Dissipation factor 0.0025
Copper foil thickness 12,18 m
Insulation resin thickness 40,70 m
Features
Low Permittivity Build-up Board @Low Dielectric Constant of 2.8 equivalent to Teflon
AHi Tg, Low CTE contributes to Heat Resistance and Reliability
BHalogen Free