PWB Corporation

■ One piece quick turn prototype and small to large lot production
■ Double sided and 4 to 68+ layer PCBs
■ Laser plotter and etching line for 30μm line width
■ Special plating line for aspect ratio of 20 to 1.
■ Processing technology of 50Ω±5% impedance controlled PCB

Integration of all technologies of manufacturing and know-how for fine pitch. high layer count, high aspect ratio plating. controlled impedance, and the low permittivity material is the key to manufacturing the semiconductor tester boards.

■ Quick-turn fabrication of high layer count PCB

(20-68 Layers, SVH, Build-up PCB)

■ High aspect ratio PCB fabrication by in-house special plating line

(ex. 0.25mm FHS for 5.4mm thickness board, Aspect ratio = 21:1)

■ 1.1-1.5um electroless gold surface finish

(Pogo area may be finished with thick bonding gold)

■ Fabrication of fine pitch CSP device PCB

■ Material Characteristics Frequency 1〜10 Dielectric constant 2.8 Dissipation factor 0.0025 Copper foil thickness 12,18 μm Insulation resin thickness 40,70 μm

■ Features �@Low Dielectric Constant of 2.8 equivalent to Teflon �AHi Tg, Low CTE contributes to Heat Resistance and Reliability �BHalogen Free