PWB Corporation

Design of PCB for electronics appliances was our beginning. JapaneseEnglish
About
Product
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Policy  Vision
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We contribute to the Electronic Industry of tomorrow with our quality PCBs based on solid technology and diverse ideas. Gallery

System Development

Hardware Development capability
yDesign specz Research of Technical Trend,
Value Analysis Recommendation
(Cost/Lead-time/Quality), Test Method Suggestion.
ySchematic Designz Image Processing Engine Platform.
Multiple Memory System.
y P z H8, SH series, ARM, PQV, TEGRA
MPC series, etc
yFPGAz ALTERA Stratix series.
Cyclone series.
XILINX Vertex series.
Spartan series.
Kintex series.
yAnalogz A/D, D/A, Filter
Software Development capability
yP softwarez C, VB, Assembler
yIP Technologyz IP, UDP, TCP, HTTP, TELNET
yCommunication Technologyz Specified Low Power Radio Station.
WiFi, NFC, Bluetooth.
Equipment
OrCAD capture, Protel, System-Designer
Altera-MAX+PlusII, QuartusII, Xillinx-ISE, Design-Gateway

OEM/EMS

Case Design(Architectural Design/Mock Design)
yPlate metalz Sheet metal processing, metal cutting, Tooling and Molding
yresinz Rapid prototyping(Stereolithography, Laser Sintering, Fused Deposition), Rapid Prototype Tooling(silicon-type, aluminum-type),Tooling and Molding
yFinishingz face plate, painting, plating, alumite treatment
Component Procurement, Assembly and Wiring
EMC/Safety Certificate Acquisition,Vibration/Aging/Reliability Test. Support service, Translation and Documentation
Equipment
yDesign/2Dz
AutoCADiLT2006j
yDesign/3Dz Pro/ENGINEERiWILDFIREj
yetc.z Temperature and Humidity chamber, Electric measuring instrument.

PCB Design

PCB Design capability
PCI-EXPRESS, HDMI, SATA, MIPI, 4K2K
DDR3 SDRAM, Optical Module Device.
Audio/Video Device, High-speed switching Device.
High-Voltage 400V, High-Current 30A, RF 5.8GHz.
Schematic Design
Transmission Line Analysis Reflection analysis
1.Overshoot@@@2.Undershoot
3.Ringing back@@4.Non Monotonic
Crosstalk analysis, Clock wave analysis
EMI Simulation
EMI-DRC, Resonants Analysis
Equipment
yAnalysisz MENTOR ICX, DEMITASNX
ySchematic Designz ZUKEN Design Gateway, OrCAD Capture, Protel, ZUKEN System/Designer
DG(Design-Gateway)
yPCB Designz CADENCE Allegro, SPECCTRA Router
ZUKEN Board/Designe
yCAM Editz VALOR Enterprise, ORBOTECH Genesis,ORBOTECH InCAM

Fabrication

Fabrication capability
yClassz Single/Double side, MLB, High-MLB(68 layers), Stacked build up, SVH-board, Rigid Flexible
ySpecz Minimum Line/Space : 50/50ʂ
Minimum VIA diameter : 0.1(Mechanical)
Layer count : 2layers`68layers
Thickness : 0.2`6.5mm
Board size : 600~500mm
Impedance control : 28}10%, 50}5%
Aspect ratio : 21
Power board : 175m cupper foil
yMaterialz FR4, FR5, Polyimide, Halogen Free, etc.

Assembly

Assembly capability
yClassz SMT, DIP
ySpecz Maximum size : S550~500mm
Thickness : 0.4`6.5mm
Parts size : chip 0603, 1005
@@@@@@ CSP/BGA 0.2mm pitch
@@@@@@ QFPETSOP 0.4mm pitch
Solder : Eutectic solder, Lead-Free solder
Etc : Press-fit connector
@@@ CSP/BGA rework
@@@ N2-Reflow