Service

Features of Assembly

We can handle a wide range of needs, from short lead times for prototypes starting from a single sheet, to small-scale production to large-lot mass production.
We also provide X-ray inspection equipment, 3D appearance image inspection equipment, and an inspection system using ICT, as well as special mounting such as BGA/CSP rework, flip chips, and wire bonding.

SMD implementation line

Implementation ability

Size600×500mm
Plate thickness6.35t
Chip size0201
ReflowN2 compatible
Inspection equipmentX-ray, 3D image inspection, ICT

Parts Procurement

With a diverse network of over 50 companies, both domestic and overseas, we can provide parts procurement with short lead times for small quantities of prototypes, low cost for mass production, and stable supply.
General-purpose resistors/capacitors (1005, 1608) are always in stock.

Various examples of support

Ultra-small chip size mounting0201/03015 chip mounting
Rework0.35mm CSP rework, 0.4mm BGA reballing
0.5mm CSP ⇔ 0.5mm QFN conversion board
0.35mm CSP Jumper wire pull-out
Flip chip mountingMinimum 250μm pitch
Dicing compatible, NCP method compatible
ICT inspection equipmentOpen/short check/LCR measurement
Wire bondingMinimum 150μm pitch
Reduced chip size implementation
CSP⇒QFN conversion board
Wire bonding
ICT inspection equipment

PWB Corporation

203-39 Hashiokacho, Kusatsu City, Shiga Prefecture, 525-0065

Telephone number: 077-562-7686 (main)
Fax number: 077-562-8166