Service

Design Features

We started out from designing circuit boards.
Using technology cultivated over many years of experience, we handle approximately 800 high-quality circuit board designs per year.
By working in cooperation with our in-house circuit board manufacturing and mounting factories, we are able to offer designs that make use of our know-how in circuit board manufacturing and mounting.
We have an extensive track record of designing in a wide range of genres, from high-speed digital signal processing for image processing, in-vehicle equipment, and laptops to high-voltage devices such as inverter devices.

Board design CAD environment

■ Allegro(Cadence)
■ CR-5000 Board Designer(Zuken)
■ CR-8000 Design Force(Zuken)
■ Altium Designer(Altium)

Supported standards

■ PCI Express Gen1 ~ Gen5
■ HDMI 1.0 ~ 2.1
■ MIPI D-PHY / M-PHY / C-PHY
■ USB 1.0 ~ 3.2 / USB4
■ DDR3 / DDR4 / LPDDR4

SoC-LPDDR4 wiring pattern

simulation

We use simulation to solve problems related to SI (signal quality), PI (power quality), EMC, and heat.
By performing simulation in parallel with the board design, we can shorten the time required for simulation and reduce the risk of having to redesign.

Simulation Environment

■ SIWave(ANSYS)
■ HFSS(ANSYS)
■ DEMITAS NX(NEC)

SI analysis

From a few megahertz to orders of gigahertz or more, we analyze and optimize signal waveforms and losses at the board design stage and reflect this in the design data.

Transmission Line Analysis
S-parameter extraction
Eye pattern analysis

PI analysis

We analyze and optimize the pattern, constants and numbers of capacitors to be connected in order to meet the required specifications for the power supply, and reflect the design data.

Input impedance (AC analysis)
IR Drop (DC Analysis)

EMC analysis

It is possible to perform frequency (resonance) analysis of PCB planes, which have a significant effect on EMI, and EMS (susceptibility) analysis, as well as EMI near-field/far-field radiation analysis using an electromagnetic field solver.

Plane Resonance
Near-field EMI
EMI far field

Thermal analysis

We propose various heat countermeasures based on the results of analysis ranging from simple analysis by upstream thermal design (PCB equivalent thermal conductivity / thermal network method / device surface temperature calculation) to thermal fluid simulation.

Device heat dissipation judgement
Device surface temperature calculation
Thermo-fluid simulation

PWB Corporation

203-39 Hashiokacho, Kusatsu City, Shiga Prefecture, 525-0065

Telephone number: 077-562-7686 (main)
Fax number: 077-562-8166